Technology Roadmap   Downloadable PDF

 

     
FEATURE STANDARD ADVANCED
Line Width .005 .0030
Conductor Spacing .006 .0030
Layer to Layer .005 .003
PCB Thickness +/- 10% +/- 7%
Profile Dimensions +/- .010 +/- .005

 

PAD AND HOLE
Finished Hole Size .009 .006
Plated Hole (Minimum) .013 .008
Aspect Ratio 8:1 18:1
PTH Tolerance +/- .003 +/- .002
Inner Layer Pads DIA. (Minimum) .020 over nominal .018 over nominal
Outer Layer Pads DIA. (Minimum) .020 over nominal .018 over nominal
 

 

LPI Solder Mask
Trace to Pad Spacing .006 .004
SMT Pad Spacing .004 .003
Annular Ring (LPI) .003 .002
LPI Colors Available Green (std), Red, Blue, Black, Clear

 

LINE WIDTH AND SPACES
Copper Weight Finished Lines/Spaces Etch Compensation
.375 oz .0025/.003 .0005
.5 oz .003/.004 .001
1 oz .005/.005 .001
2 oz .005/.008 .002
3 oz .008/.010 .003
4 oz .010/.013 .005
5 oz .010/.018 .007
 

 

OTHER CAPABILITIES STANDARD ADVANCED
Panel Size (Std) 18" x 24"
Panel Size (Max) 21" x 24" 21" x 28"
Maximum Board Thickness .187" .250"
Minimum Board Thickness .005 D/S .014 Multilayer
Minimum Core Thickness .004 .0025
Maximum Copper Thickness
     Internal 5 oz 5 oz
     External 6 oz 6 oz
Minimum Copper Thickness
     Internal .5 oz .375 oz
     External .5 oz .375 oz
Maximum Layer Count 16 Layer 32 Layer
Surface Finishes HASL, Immersion Tin, Immersion Gold, Immersion Silver, Tin Nickel, OSP (Entek), Nickel /Gold available.
   
U.L. RECOGNIZED  
Material -Max Operating Temp. of 130ºc (MOT)
-FR4 Materials (180ºc Tg)
-Getek, Getek II (GE)
   
Agency Certifications  U.L. File # E46269N 6/98
ISO-9001:2000 Orion Registrar Inc., USA
Certificate # MN-52-02-01 (1/9/02 Thru 1/8/05)
MIL-PRF-55110 certified
   
SPECIALTY PRODUCT MATERIALS  
  • Teflon, Polyimide, BT
  • Rogers (4003,4350 and 3006)
  • Getek / Getek II (GE) / Nelco 4000-13
  • Standard FR-4 materials (180Tg)

COMMUNICATION FORMATS
Drill Files Excellon V1
Artwork Gerber Format (274 or 274X)
Fabrication Drawings HPGL, DXF, DWG, PLT (274 & 274X)
Email
FTP Site ftp.protechmn.com (data)